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1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board

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1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board

Brand Name : WITGAIN PCB

Model Number : S04O4669A0

Certification : UL Certificate

Place of Origin : China

MOQ : Negotiable

Price : Negotiable

Payment Terms : T/T

Supply Ability : 1kkpcs/month

Delivery Time : 15 work days

Packaging Details : 20pcs/bag, 10bags/carton

Board Thickness : 1.6MM

Material : FR4, TG150

Min Hole : 0.3MM

Copper Thickness : 1/1/1/1OZ

Solder Mask : Blue

Surface Treatment : OSP

Min Trace : 6/6Mil

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4 Layer Blue Solder Mask FR4 Printed Circuit Board

PCB Specifications:

Layer Count: 4 Layer PCB
Material: FR4, TG150
Board Thickness: 1.6MM
Min Hole: 0.3MM
Hole Stucture: L1-L4
Min Trace: 6/6Mil
Unit Size: 175MM*164MM
Solder Mas:Blue
Surface Treatment: OSP
Application: Speaker

Capabilities:

NO Item Capability
1 Layer Count 1-24 Layers
2 Board Thickness 0.1mm-6.0mm
3 Finished Board Max Size 700mm*800mm
4 Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
5 Warp <0.7%
6 Major CCL Brand KB/NanYa/ITEQ/ShengYi/Rogers Etc
7 Material Type FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
8 Drill Hole Diameter 0.1mm-6.5mm
9 Out Layer Copper Thickness 1/2OZ-8OZ
10 Inner Layer Copper Thickness 1/3OZ-6OZ
11 Aspect Ratio 10:1
12 PTH Hole Tolerance +/-3mil
13 NPTH Hole Tolerance +/-1mil
14 Copper Thickness of PTH Wall >10mil(25um)
15 Line Width And Space 2/2mil
16 Min Solder Mask Bridge 2.5mil
17 Solder Mask Alignment Tolerance +/-2mil
18 Dimension Tolerance +/-4mil
19 Max Gold Thickness 200u'(0.2mil)
20 Thermal Shock 288℃, 10s, 3 times
21 Impedance Control +/-10%
22 Test Capability PAD Size min 0.1mm
23 Min BGA 7mil
24 Surface Treatment OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc




FAQ:

Quesion: What is Organic Solderability Preservative (OSP) or Anti-Tarnish Surface Finish?
Answer: The overall functionality of a PCB board depends upon the conductivity of copper tracks. These tracks tend to oxidize when exposed to the atmosphere, which creates a problem when soldering components on the board. Organic Solderability Preservative (OSP) regulates two things; temporary protection of exposed copper from being oxidized and improving the solderability before component fixation (assembly).
OSP is a very thin (100-4000 Angstroms) organic coating on the PCB board, which is a water-based chemical compound of the ‘Azole family’ such as benzotriazoles, imidazoles, and benzimidazoles. This compound gets absorbed by the exposed copper and generates a protected film.
Advantages of Organic Solderability Preservative:

  • Low cost
  • Environment-friendly
  • Re-workable, but can’t take more than 2-5 rounds of reflow soldering before degradation
  • It is lead-free and can handle SMT components easily
  • Provides a coplanar surface, well suited for tight-pitch pads (BGA, QFP).

1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board
Disadvantages of Organic Solderability Preservative:

  • Not Good for PTH (Plated Through Holes)
  • Short Shelf Life, less than 6 month
  • Inspection is difficult as it is transparent and colorless
  • requires careful handling, as it’s susceptible to mechanical damage

OSP Surface Finishing Process:
The OSP finishing process is composed of three major steps that include pre-cleaning and making the PCB board ready to apply a smooth OSP coating:

  1. Clean: Organic contaminants such as oil, fingerprints, oxidation film etc. are removed to get a clean PCB board.
  2. Topography Enhancement: To improve the bonding forces between exposed copper and OSP film, micro-etching is performed to minimize the oxidation generated on copper.
  3. Deionization Rinse: Before the final OSP application, the OSP solution is populated by ions so that it can be eliminated easily during soldering.

1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board





Product Tags:

FR4 Printed Circuit Board

      

OSP 4 Layer PCB Board

      

1.6MM Printed Circuit Board

      
China 1.6MM Blue Solder Mask OSP 4 Layer Printed Circuit Board wholesale

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